![Table 1 from A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration | Semantic Scholar Table 1 from A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/e9af00425a7871bc231b82dc662353d3accd08af/1-Table1-1.png)
Table 1 from A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration | Semantic Scholar
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Next-Generation DDR4 and LPDDR4 IP in TSMC 16FF+ Enable 200Gb+ Data Transfers for Mobile, Cloud, and IoT Platforms - Tensilica and Design IP - Cadence Blogs - Cadence Community
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